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Google Pixel 10 Series Codename Reportedly Leaks, Suggesting Launch of Four Models Next Year

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Google Pixel 9 sequence was launched final month and the hearsay mill about its successor – the Pixel 10 sequence – has already kicked into gear. The codenames for the alleged Pixel 10 smartphones have been leaked. The Pixel 10 is alleged to be codenamed ‘Frankel’, whereas comparable names have additionally been given to different purported handsets within the upcoming sequence. The leak suggests the launch of 4 purported fashions subsequent yr, persevering with the development set by the Pixel 9 lineup.

Google Pixel 10 Series Codenames Leak

According to an Android Headlines report, the Google Pixel 10 sequence will embody 4 fashions: Pixel 10, Pixel 10 Pro, Pixel 10 Pro XL, and Pixel 10 Pro Fold. They have been given the codenames Frankel, Blazer, Mustang, and Rango, respectively. The report successfully means that Google could once more launch a foldable smartphone subsequent yr.

This improvement builds upon earlier leaks that exposed the codename of the Google Pixel 9a – the one smartphone from the corporate which is slated to debut earlier than the Pixel 10 sequence subsequent yr. The Pixel 9a is anticipated to launch in May subsequent yr and should have the codename ‘Tegu’. Like yesteryears, it is going to be a part of the Pixel 9 sequence as the corporate’s newest smartphone lineup.

However, Google could change issues up subsequent yr by providing an older chipset with its reasonably priced Pixel 9a.

Google Pixel 10 Chipset

In addition to codenames, a earlier report instructed that Google could have accomplished the design technique of the Tensor G5 chipset that can energy the Pixel 10 sequence. It is purported to have reached the “tape out” stage, which successfully implies that the Mountain View-based tech large can now produce it at a foundry and check it totally.

Unlike the earlier 4 generations which have been primarily based on an Exynos chip from Samsung, Tensor G5 is alleged to be absolutely developed in-house. It is tipped to be fabricated utilizing TSMC’s second-generation 3nm node (N3E), additional simplifying the preliminary N3B course of.



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