Honor Magic 7 Pro Full Specifications Surface Online; Tipped to Get Snapdragon 8 Gen 4 SoC

Honor Magic 7 Pro is anticipated to launch quickly as a successor to the Magic 6 Pro 5G, which was lately unveiled in India. Details in regards to the purported smartphone have surfaced on-line over the previous few weeks. Key options and anticipated design of the handset have been leaked. Now, a report has advised the whole checklist of anticipated specs of the Magic 7 Pro. The cellphone is tipped to return with Qualcomm’s Snapdragon 8 Gen 4 chipset and a 50-megapixel triple rear digital camera unit.

Honor Magic 7 Pro Specifications, Features (Expected)

The Honor Magic 7 Pro is anticipated to sport a 6.82-inch 2K dual-layer OLED display with quad-curved edges, a 120Hz refresh fee, and Honor’s eye safety 3.0, in line with a CNMO report. The show might include 8T LTPO know-how in addition to Kunlun Glass safety. It is tipped to be powered by the Snapdragon 8 Gen 4 chipset, paired with UFS 4.0 onboard storage and LPDDR5X RAM.

For optics, the Honor Magic 7 Pro will probably get a triple rear digital camera system, which can embody a 50-megapixel OmniVision OV50H main sensor and a 50-megapixel sensor paired with an ultra-wide-angle lens. The third rear digital camera unit might embody a 50-megapixel Sony IMX882 periscope telephoto shooter or a 200-megapixel Samsung ISOCELL HP3 sensor. Meanwhile, the entrance digital camera of the handset is tipped to characteristic a 50-megapixel sensor alongside a 3D depth sensor.

According to the report, the Honor Magic 7 Pro is anticipated to pack a 5,800mAh battery backed by third-generation Qinghai Lake battery know-how. The smartphone could include assist for 100W wired and 66W wi-fi charging.

For safety, the Honor Magic 7 Pro is tipped to be outfitted with an ultrasonic fingerprint sensor and a 2D face recognition characteristic. The cellphone could have an IP68 or IP69-rated construct for mud and splash resistance. It is anticipated to assist satellite tv for pc communication and will carry the C1+ RF chipset alongside an E1 effectivity chip, in addition to an x-axis linear motor.