Switch to RCC materials placed on maintain
In an X (previously Twitter) put up, analyst Ming-Chi Kuo notes that Apple has as soon as once more delayed its plans to make use of RCC parts in its future iPhone fashions. “Due to the lack to fulfill Apple’s high-quality necessities, the brand new iPhone 17 in 2025 won’t use RCC because the PCB motherboard materials,” Kuo wrote on X.
Employing RCC parts to exchange the present copper-clad laminate (CCL) would assist the Cupertino-based firm cut back the dimensions and thickness of the mainboard. It is prone to additionally unlock house and permit the model to pack larger batteries in future iPhone fashions. Concerns over sturdiness and fragility may very well be the explanation for delaying the adoption of RCC expertise.
Initially, Apple was rumoured to improve the PCB supplies in its iPhone 16 lineup in 2024, but it surely was then reportedly pushed to the iPhone 17 collection. Kuo would not say whether or not RCC parts will probably be launched with the iPhone 18 in 2026 or the iPhone 19 in 2027. However, Apple has not revealed any particulars about switching to RCC supplies but so it is higher to take these newest claims with a grain of salt.
iPhone 17 collection: What we all know to this point
Apple’s 2025 iPhone household is claimed to incorporate 4 fashions — iPhone 17, iPhone 17 Slim, iPhone 17 Pro, and iPhone 17 Pro Max. The Slim mannequin might exchange the Plus variant and provide a slim design. The iPhone 17 household is anticipated to convey a refreshed design, front-facing digital camera upgrades, and a smaller Dynamic Island. The iPhone 17 Pro fashions are mentioned to be powered by Apple’s A19 Pro chip whereas common iPhone 17 and iPhone 17 Slim might run on an A18 or A19 chip.
