MediaTek to Introduce New Dimensity Chipsets on December 23

MediaTek will introduce next-generation Dimensity chipsets in China subsequent week. The Taiwanese semiconductor firm, by way of its social media deal with, confirmed the launch of latest chips with out revealing their names. MediaTek’s rumoured Dimensity 8400 SoC is anticipated to debut on the launch occasion because the successor to final yr’s Dimensity 8300 SoC. The purported 4nm chip might use a 1+3+4 structure. It is claimed to have scored greater than 1.8 million factors in AnTuTu benchmarks.

In a Weibo put up, MediaTek announced that its next-generation Dimensity chips shall be launched on December 23 at 03:00pm (12:00pm IST). The model, nevertheless, did not disclose the precise moniker of the upcoming chipsets, however primarily based on current rumours we are able to count on considered one of them to be the Dimensity 8400 SoC.

MediaTek Dimensity 8400 Specifications (Expected)

MediaTek is anticipated to introduce the Dimensity 8400 SoC because the successor to the Dimensity 8300 SoC. The upcoming octa-core processor manufactured utilizing TSMC’s 4nm expertise is prone to have a 1+3+4 structure. It might embrace the Immortalis-G720 MC7 GPU and is claimed to have scored over 1.8 million factors in AnTuTu benchmarks.

The Dimensity 8400 SoC is tipped to pack a chief CPU core clocked at 3.25GHz, three cores capped at 3.0GHz and 4 cores capped at 2.1GHz. It is anticipated to rival Qualcomm’s Snapdragon 8 Gen 3 chipset.

OEMs are prone to pack the Dimensity 8400 SoC in smartphones with an preliminary price ticket of CNY 1,500 (roughly Rs. 17,250). The purported Redmi Turbo 4 is anticipated to be the primary smartphone to debut with the Dimensity 8400 chipset. It is claimed to go official in China in January subsequent yr. The handset could possibly be launched in markets outdoors China with the Poco X7 moniker.

The rumoured Oppo Find X8S and Redmi K80E are additionally purported to run on the rumoured MediaTek Dimensity 8400 chipset.